We supply ultra-fine T1 high-purity copper wire and tinned copper wire in diameters from 0.05 to 0.20 mm. These products are used in industrial cables, electronic wire, conductor fabrication, and high-end wire harness manufacturing. With excellent elongation, controlled oxygen content, and consistent quality, our wire meets the demands of new energy vehicles, consumer electronics, and industrial cabling applications.
We focus on the continuous production and quality control of ultra-fine (0.05–0.20mm) copper and tinned copper wires, covering the complete process chain from electrolytic copper rods to finished copper wires, providing highly consistent and traceable raw material solutions for harness and conductor processing customers.
Selecting high-purity T1 electrolytic copper with low oxygen and few impurities ensures the elongation and conductivity of ultra-fine wires, reducing drawing breakage and stress concentration.
Continuous drawing process achieves stable control of single wire diameter, meeting the requirements of high-end fine wire applications such as industrial cables, electronic wires, earphone cables, enameled wires, and sensor wires.
Quality control throughout all links from copper rod, annealing, continuous drawing to packaging. Each batch of products is accompanied by quality assurance data and traceability information to minimizing process variability for customers.
Through continuous drawing and multi-pass precision annealing, the structural uniformity and mechanical stability of 0.05–0.20mm single wires are guaranteed.
T1 high-purity copper rod, low oxygen & impurities
Multi-pass precision drawing to target diameter
Uniform temp/humidity annealing, softening treatment
Optional tin layer, solderability & anti-oxidation
Small/large spools, batch traceable packaging
The following are typical technical specifications for T1 pure copper wire and tinned copper wire from the Copper Division. Specific specifications are subject to contract and quality certificate.
| Item | Specification | Description |
|---|---|---|
| Material Grade | T1 Electrolytic Copper | Compliant with GB/T 2059 and other general copper and copper alloy plate/wire grade systems |
| Copper Content | ≥ 99.95% | High-purity copper, low oxygen, beneficial for fine wire elongation and conductivity |
| Single Wire Diameter | 0.05 – 0.20 mm | Ultra-fine spec, supports multi-strand twisting and direct single wire application |
| Temper | Annealed | High elongation, soft, easy for subsequent insulation covering and twisting |
| Coating Type | Bare Copper / Tinned (Optional) | Tinned wire has solderability and anti-oxidation ability, suitable for soldering process |
| Tensile Strength | Varies with spec and temper | Subject to actual test COA data, supports soft state high elongation requirements |
| Elongation | High Elongation | Meets bending, twisting and repeated bending applications |
| Packaging Form | Large / Small Spools | Supports bulk pallet delivery and continuous production line supply |
* The above is a general technical specification framework. Actual supply is subject to the Certificate of Analysis and Quality Certificate for each batch of products.
0.05–0.20mm ultra-fine copper wire is widely used in high-end conductors and electronic connection applications due to its softness, low resistance, and easy processing.
Ultra-fine copper conductors for sensor harnesses, sampling wires, and high-end electronic wires, balancing softness and conductivity.
Supports multi-strand twisting and braiding structures for industrial control, robotics, and high-end signal transmission cables.
Low oxygen, high elongation copper wire ensures reliability under repeated bending, meeting precision instrument and probe wire requirements.
Tinned copper wire is suitable for automotive electronic harness applications requiring soldering reliability and oxidation resistance.
Ultra-fine soft copper wire for high-flex cables and micro connections in consumer electronics, AR/VR, and communication terminals.
Supplies ultra-fine soft copper wire for micro DC motors, linear vibration motors, dynamic driver units (TWS earphones), and miniature inductors, meeting the demands of stable conductivity and fatigue resistance under high-speed, compact-form-factor operation.